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加快在卫星互联网等新兴领域部署 必博半导体完成数亿元A轮融资
Sou Hu Cai Jing·2025-09-21 14:32

Group 1 - The company is focusing on satellite internet, low-altitude economy, industrial IoT, vehicle networking, and AI-driven consumer electronics in its latest financing round [1][3] - The financing will enhance the company's capabilities in chip research and ecosystem development for lightweight 5G and high-bandwidth 5G standards [1][3] - The CEO of the company emphasizes that the new financing will accelerate product development and commercialization processes [3] Group 2 - The company has developed a lightweight 5G+4G+satellite tri-mode fusion chip, U560, which achieves full coverage across air, land, and sea [4] - The U560 chip has successfully completed all technical validations and boasts three core advantages: 12nm RF-SoC process, improved positioning accuracy, and partnership with China's Xingwang for S-band mobile direct connection terminal chips [4] - The company has previously secured 1 billion yuan in angel round investment and 3 billion yuan in Pre-A round financing from various institutions [4]