臻镭科技实控人、董事长郁发新被留置，其还担任浙江大学教授

Core Viewpoint - Zhejiang Zhenlei Technology Co., Ltd. announced that its chairman, Yu Faxin, is under investigation and cannot perform his duties, but the company's operations remain normal and unaffected [1] Group 1: Company Management and Governance - Yu Faxin, the chairman, is currently unable to fulfill his responsibilities due to being placed under detention by the Huangshi Municipal Supervisory Committee [1] - During Yu's absence, director Zhang Bing will assume the role of chairman, while other board members and senior management continue their duties as normal [1] - The company has not received any investigation notices from relevant authorities and is unaware of the progress or conclusions of the investigation [1] Group 2: Shareholding and Financial Performance - As of September 4, Yu Faxin holds 45.04 million shares, representing 21.04% of the company, making him the largest single shareholder [2] - The market value of Yu's shares is approximately 3.1 billion yuan, based on a closing price of 69.5 yuan per share on September 19 [2] - In 2024, Yu's pre-tax remuneration from the company is reported to be 960,800 yuan [3] - On September 4, three investment partnerships reduced their holdings by 8.31 million shares, accounting for 3.88% of the total share capital, raising approximately 440 million yuan [3] - Following this reduction, Yu and his concerted parties hold 61.51 million shares, or 28.74% of the total share capital [3] - For the first half of 2025, the company reported revenue of 205 million yuan, a year-on-year increase of 73.64%, and a net profit of 62.32 million yuan, a year-on-year increase of 1006.99% [3] Group 3: Company Overview - Founded in September 2015, Zhenlei Technology specializes in terminal RF front-end chips, high-density packaged microwave modules, and microsystems [4] - The company is recognized as a national high-tech enterprise and has established a provincial-level high-tech enterprise R&D center [4] - Zhenlei Technology has become a core supplier in the domestic communication and radar sectors for RF chips, microsystems, and modules [4]