天玑9500单核性能逼近苹果旗舰？vivo将首发

Core Viewpoint - MediaTek has launched its new flagship mobile SoC, the Dimensity 9500, which will debut in the vivo X300 series smartphones [1] Group 1: Product Features - The Dimensity 9500 utilizes TSMC's N3P process and features a full big-core CPU design, including the world's first Arm C1 series CPU cluster and G1-Ultra GPU, along with new dual NPU and ISP image processing units [1] - The CPU architecture consists of 1 C1-Ultra super core at 4.21GHz, 3 C1-Premium super cores, and 4 C1-Pro big cores, supporting 4-channel UFS4.1 flash storage [3] - Single-core performance has improved by 32% and multi-core performance by 17% compared to the previous generation, with peak power consumption for super cores reduced by 55% and multi-core peak power consumption down by 37% [3] Group 2: Performance Metrics - MediaTek's lab data shows the Dimensity 9500 achieving a GeekBench single-core score of 4007 and a multi-core score of 11217 [4] - Real-world testing by @Zealer reported a single-core score of 3610 and a multi-core score of 10765, indicating that Android flagship performance is now comparable to Apple's current flagship [4] Group 3: Market Position and Future Plans - The first smartphones featuring the Dimensity 9500 are expected to launch in Q4 2025, with vivo's X300 series and OPPO's Find X9 series confirmed to use the new chip [6] - MediaTek is negotiating with TSMC to produce some chips in the U.S. to mitigate potential tariff risks, particularly for automotive and sensitive application chips [7] - MediaTek has announced further collaboration with TSMC to be among the first to adopt TSMC's 2nm process technology, with a new SoC design expected to achieve an 18% performance increase and a 36% reduction in power consumption compared to the current N3E process [7]