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ETF市场日报 | 芯片、半导体板块逆市上行!十四只科创债ETF明日集体上市
Sou Hu Cai Jing·2025-09-23 07:36

Market Overview - A-shares experienced wide fluctuations with the Shanghai Composite Index down 0.18%, Shenzhen Component Index down 0.29%, and the ChiNext Index up 0.21% [1] - The total trading volume in the Shanghai and Shenzhen markets reached 24,944 billion [1] ETF Performance - The Chip Equipment ETF (560780) led the gains with an increase of 7.72%, followed by the Semiconductor Materials ETF (562590) at 6.04% and the EasyOne Semiconductor Equipment ETF (159558) at 5.76% [2] - The financial technology sector saw significant declines, with the 2000 ETF (159907) dropping by 9.46% [4] Semiconductor Industry Insights - Huatai Securities predicts a 14% year-on-year growth in semiconductor capital expenditure for 2025, reaching $148 billion, while the global equipment market is expected to grow by 12% to $142 billion [3] - The Chinese market is anticipated to continue its investment cycle led by advanced processes, presenting opportunities for domestic equipment companies [3] - The demand for high-bandwidth memory (HBM) products is increasing, with SK Hynix completing HBM4 development, which will drive the market for high-end storage testing equipment [3] ETF Trading Activity - The Short-term Bond ETF (511360) had the highest trading volume today at 34.1 billion [5] - The S&P Consumer ETF (159529) recorded the highest turnover rate at 383% [6] Upcoming ETF Listings - Fourteen new Sci-Tech Bond ETFs are set to be listed on September 24, 2025, from various fund companies, including Wan Jia, Tian Hong, and Yin Hua [6][7] - These ETFs are designed to track indices related to AAA-rated technology innovation company bonds, appealing to investors seeking stable returns with lower risk [7]