奥士康加速布局AI算力领域，高阶HDI产品实现规模化交付

Core Insights - The company held a recognition event for the DGX Spark AI supercomputer project, highlighting the contributions of core teams in customer development, product research, engineering design, and mass production [1] - The DGX Spark AI supercomputer demands extreme performance, reliability, and stability from PCB technology, which the company has addressed through advanced interconnect technology, high-frequency materials, and innovative packaging techniques [1][3] - The company has established a complete AI computing infrastructure solution, demonstrating its capability to handle high-end AI computing projects from technology development to mass production [3] Technology and Production Capabilities - The company has achieved a four-layer HDI mass production capability and has successfully developed six-layer HDI technology for small batch supply, catering to high-end market demands such as AI servers and high-performance computers [3] - The company’s advancements in signal integrity optimization, thermal management, and multilayer wiring design have led to a perfect balance of high precision, stability, and efficiency in its products [1][3] Market Position and Future Outlook - The demand for AI computing power is experiencing explosive growth due to the emergence of large models like DeepSeek, positioning the company as a key supplier of high-end PCB products essential for AI supercomputers [3] - The company is expected to expand its high-end production capacity as it deepens its technological investments and industry layout in the AI computing sector, supported by the release of production capacity in Thailand and the implementation of convertible bond projects [3]