


Core Viewpoint - The report from CITIC Securities indicates that three technological trends will significantly enhance the usage and importance of etching equipment: (1) adoption of multiple patterning in photolithography, (2) demand for 3D stacked storage and near-memory computing, and (3) upgrades in underlying transistor structures [1][2]. Group 1: Multiple Patterning - The current EUV lithography technology is limited, making DUV multiple patterning a key strategy for domestic breakthroughs, leading to a substantial increase in the usage of etching equipment [3]. - The DUV multiple patterning method allows for continued iteration down to 3nm, with the etching equipment usage in production lines increasing up to four times compared to the EUV method [3]. Group 2: 3D Stacking Demand - The increase in storage layers for 3D NAND and DRAM is driving exponential growth in the demand for etching equipment, with the usage share rising from 35% to 48% as layers increase from 32 to 128 [4]. - The need for higher aspect ratio etching equipment is also growing, with current mainstream 3D NAND using a 60:1 aspect ratio, and future technologies expected to reach 90:1 for higher layer counts [4]. - TSV (Through-Silicon Via) processes, essential for 3D expansion in packaging, require etching and filling equipment, which constitutes nearly 70% of the TSV process, further increasing demand for etching equipment [4]. Group 3: GAA Transistor - The introduction of GAAFET technology, which will replace FinFET, is expected to increase the etching process steps from 5 to 9, leading to a rise in the share of etching equipment from 20% to 35% in advanced processes [5]. - The value of individual etching equipment is projected to grow by 12% year-on-year, with new demands for high-selectivity SiGe isotropic etching processes emerging, particularly through Atomic Layer Etching (ALE) methods [5].