中瓷电子：碳化硅芯片晶圆工艺线处于产品升级及客户导入阶段

Core Viewpoint - The company has made significant advancements in its silicon carbide chip production and new product development, indicating a strong position in the semiconductor industry [1] Group 1: Silicon Carbide Chip Production - The silicon carbide chip wafer process line has been upgraded from 6 inches to 8 inches and is currently operational, entering the product upgrade and customer onboarding phase [1] - The company is actively working on the development of 3.2Tbps products in collaboration with customers, expanding its capabilities in high-speed communication [1] Group 2: New Product Development - The company has achieved milestone progress in the research and development of ceramic components, successfully validating them with domestic semiconductor equipment and achieving mass production [1] - The aluminum nitride multilayer thin and thick film products have seen rapid growth, with applications in high-frequency and high-speed optical modules, particularly in AI and data center scenarios [1] Group 3: Optical Communication Devices - The company’s optical communication device housings have achieved transmission rates covering a wide range from 2.5Gbps to 1.6Tbps, all of which are in mass production [1]