Xuan Gu Bao·2025-09-25 14:35Group 1 - Intel showcased its next-generation Xeon processors at the 2025 Yunqi Conference, utilizing the new Intel 18A process technology and Foveros Direct3D advanced packaging technology to enhance performance and efficiency [1] - The advanced packaging market is rapidly growing, driven by AI market demand, with a projected market size increase from $44.3 billion in 2022 to $78.6 billion by 2028, representing a compound annual growth rate (CAGR) of 10% from 2022 to 2028 [1] - In the advanced packaging market, FC packaging held the largest share at 51% in 2022, while 2.5D/3D packaging accounted for 21%. By 2028, FC packaging's share is expected to decrease to 47%, and 2.5D/3D packaging's share is projected to rise to 33%, making 2.5D/3D packaging the fastest-growing advanced packaging form [1] Group 2 - Changdian Technology possesses advanced and comprehensive chip manufacturing technologies, including wafer-level packaging (WLP), 2.5D/3D packaging, and system-in-package (SiP) solutions [1] - Northern Huachuang is actively developing in the advanced packaging field, providing comprehensive thin film deposition, electroplating, and etching equipment for 2.5D/3D packaging and system-in-package (SiP) technologies [2]