思泰克：公司自研的3D SPI和3D AOI可充分应用于光通信领域，适用光模块线路板制程环节的检测

Core Viewpoint - The company has confirmed that its self-developed 3D SPI and 3D AOI technologies can be effectively applied in the optical communication field, particularly in the detection processes of optical module circuit boards as the demand for computing power continues to grow [2]. Group 1 - The company responded to an investor inquiry regarding the applicability of its products in optical communication detection [2]. - The optical communication network is undergoing continuous upgrades, with 800G and 1.6T optical modules expected to become standard configurations [2]. - The company's technologies are positioned to support the evolving needs of the optical communication industry [2].