Taiwan Semiconductor Plans Ultra-Advanced Chips By 2028 With Massive Taichung Fab

Core Viewpoint - Taiwan Semiconductor Manufacturing Co. (TSMC) is set to begin construction on a new 1.4-nanometer fabrication plant in Taichung, expected to significantly boost production capacity and value, with plans to produce chips by 2028 [1][3]. Group 1: New Facility Details - The new facility, named Fab 25, will utilize 1.4nm technology, surpassing the previously planned 2nm process, and is projected to have an annual production value of up to 500 billion New Taiwanese dollars ($16.49 billion) [1][3]. - The construction of Fab 25 is scheduled to start in the fourth quarter, with the facility expected to create approximately 4,500 jobs [2][3]. Group 2: Expansion Plans - In addition to the Taichung facility, TSMC plans to build an advanced technology facility in Tainan's Shalun District and expand advanced packaging capacity in Chiayi County's Taibao City [4]. - The company is also preparing to commercialize 2nm chips next quarter in Hsinchu and Kaohsiung, with 1.6nm production planned for the second half of 2026 [3]. Group 3: Market Performance - TSMC's stock has increased by 41% year-to-date, outperforming the PHLX Semiconductor Index, which has gained 26% [4]. - The company's strong position as a key supplier to major clients like Nvidia and Apple has solidified its global presence across the U.S., Germany, and Japan [4].