思泰克：公司自研的核心产品3D SPI和3D AOI可针对半导体后道封装中锡膏芯片锡球、锡膏质量进行检测

Core Viewpoint - The company, Systech (301568), is advancing in the semiconductor packaging process with its self-developed core products, 3DSPI and 3DAOI, which are designed for detecting solder paste quality in semiconductor back-end packaging [1] Group 1: Product Development - The company is set to launch a new optical inspection device, the three-light machine, in 2024, which will enhance detection capabilities for various semiconductor processes including flux, system-in-package (SIP), die bonding, wire bonding, and flip chip bonding [1] - The products developed by the company aim to achieve import substitution in the semiconductor industry [1]