Core Insights - The company is focusing on the growing demand for computing power and the continuous upgrade of optical communication networks, with its self-developed 3D SPI and 3D AOI products being applicable in the optical communication field [1][3] - The company’s core products are designed to enhance process stability and yield in semiconductor advanced packaging processes by inspecting solder paste, chip solder balls, and solder paste quality [3] - The upcoming development of the third optical inspection equipment in 2024 will enable inspections across various processes, including flux, system-in-package (SIP), die bonding, wire bonding, and flip chip bonding [3] - Industry experts believe that the acceleration of upgrades in the optical communication and semiconductor supply chains will allow the company's detection products to achieve broader import substitution in high-precision application scenarios, thereby enhancing its market competitiveness in the intelligent detection equipment sector [3]
思泰克:自研3D SPI和3D AOI可应用光通信领域