TSMC(US:TSM) Jing Ji Ri Bao·2025-09-27 23:04Core Viewpoint - TSMC's capital expenditure continues to reach new highs this year, driven by strong global semiconductor expansion demand and investments in advanced packaging and testing, as well as overseas facilities [1] Group 1: Company Performance - FanTian's chairman reported that the company has over NT$90 billion in orders as of August, a historical high, benefiting from the ramp-up of advanced packaging equipment shipments in Taiwan [1] - HanTang announced a record backlog of NT$132.26 billion, with 90% of the revenue expected to be recognized within two years, indicating strong demand from both local and international clients [1] - AsiaX's cumulative backlog reached NT$208.49 billion, with 63% from the semiconductor sector, and is expected to achieve record performance this year due to strong demand in Southeast Asia [2] - YangJi Engineering maintains a high backlog of NT$37.149 billion, with operations expected to improve in the second half of the year, expanding into new sectors beyond semiconductors [2] - ShengHui has secured ten major CSP contracts, pushing its backlog to NT$47 billion, with a 50.1% year-on-year revenue increase in the first eight months of the year [2] Group 2: Market Trends - The global semiconductor industry is experiencing robust expansion, leading to increased orders and capital expenditures from companies involved in advanced packaging and cleanroom supply chains [1][2] - The demand for advanced packaging solutions, particularly CoWoS, is driving significant growth for companies like FanTian and ShengHui, with expectations of continued high operational activity through 2026 [1][2]