Group 1 - The core event is the official launch of the FCBGA packaging substrate project by CoreSys Semiconductor Technology (Dongyang) Co., Ltd., marking a significant step towards addressing the domestic shortage of high-end packaging substrates [1] - CoreSys focuses on the research, design, production, and sales of high-end packaging substrates, aiming to become a global leader in this field, with its main product being FCBGA substrates used in high-performance chips like CPUs, GPUs, and AI applications [1] - The project is planned in three phases, with the goal of achieving domestic substitution of ABF substrates and establishing a demonstration base for high-end FCBGA substrate production in China [1] Group 2 - Zhongtian Precision Decoration's 2025 semi-annual report indicates the company is leveraging opportunities in the accelerating digital and intelligent transformation, focusing on strategic transformation and investment in the semiconductor industry [2] - The company has made indirect investments in CoreSys and other semiconductor-related enterprises, aiming to create synergies with its controlling subsidiaries and enhance business capabilities [2] - Since being acquired by the Dongyang State-owned Assets Supervision and Administration Commission in June 2024, Zhongtian Precision Decoration has rapidly and deeply engaged in the semiconductor self-sufficiency and domestic substitution sectors, with the launch of CoreSys marking a significant advancement in its semiconductor strategy [2]
科睿斯半导体项目连线投产 中天精装战略转型迎积极进展