通富微电：2025年上半年公司在CPO领域的技术研发取得突破性进展 相关产品已通过初步可靠性测试

Group 1 - The company, Tongfu Microelectronics (002156.SZ), announced a breakthrough in technology research and development in the field of Chip-on-Photonic (CPO) packaging, expected in the first half of 2025 [2] - The related products have passed preliminary reliability testing, indicating progress in the company's CPO project [2] - Future developments will be determined based on customer and market demand, suggesting a responsive approach to market conditions [2]