688082火了！易方达又出手

Core Viewpoint - The largest scale of competitive private placement in the semiconductor equipment industry in the past three years has been completed, with several public funds participating in the allocation [2][12]. Group 1: Fundraising Details - Semiconductor equipment leader, Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., has completed a private placement fundraising of nearly 4.5 billion yuan [2][3]. - The total number of shares issued in this private placement is 38.6013 million shares, with an issue price of 116.11 yuan per share, raising a total of 4.482 billion yuan [3][8]. - The funds raised will enhance the company's R&D capabilities in the semiconductor equipment field [2][8]. Group 2: Participating Institutions - Five public funds participated in the private placement, including E Fund, Xingsheng Global, and others, with E Fund acquiring 144 million yuan worth of shares [3][7]. - Shanghai Pudong New Industry Investment Co., Ltd. received the largest allocation of 1.5 billion yuan, followed by Caitong Fund with 544 million yuan [3][4]. Group 3: Company Performance - Shengmei Shanghai reported a revenue of 3.265 billion yuan in the first half of the year, a year-on-year increase of over 35%, with a net profit of nearly 700 million yuan, up approximately 57% [13]. - The company has seen continuous growth in revenue and net profit from 2018 to 2024, with revenue increasing from 550 million yuan to 5.618 billion yuan, and net profit from 93 million yuan to 1.153 billion yuan, with average annual growth rates exceeding 30% [13]. Group 4: Market Context - The semiconductor market is expected to shrink by 8% in 2023 but is projected to grow by 12% to 687.3 billion dollars by 2025 [12]. - The private placement market has seen a surge in interest in technology innovation sectors, with semiconductor industry private placements reaching 19.4 billion yuan in the first seven months of the year, a fivefold increase compared to the previous year [18][19].