Group 1 - Tesla and Apple are exploring the introduction of glass substrates to enhance the performance of semiconductor chips and data centers [1] - Both companies have met with manufacturers developing glass substrates to discuss technology and potential collaboration, although no contracts have been signed yet [1] - The global glass substrate market is primarily dominated by American and Japanese companies, while domestic companies in China are accelerating their research due to growing demand [1] Group 2 - Changdian Technology has made continuous breakthroughs in key technologies such as glass substrates and advanced packaging for large-size FCBGA [2] - Wog Optical has successfully progressed in the industrial application of advanced packaging for high-performance chips in large servers through collaboration with multiple clients [3]
提升芯片+数据中心性能,苹果、特斯拉被爆引入玻璃基板封装