晶合集成电路向港交所提交上市申请

Group 1 - Hefei Jinghe Integrated Circuit Co., Ltd. has officially submitted its listing application to the Hong Kong Stock Exchange, aiming for a main board listing [1] - The exclusive sponsor for this issuance is China International Capital Corporation (CICC) [1] - Jinghe Integrated Circuit specializes in semiconductor manufacturing, with products including logic chips, memory chips, and specialty process chips, widely used in smart terminals, automotive electronics, and the Internet of Things [3] Group 2 - The company has a strong market competitiveness in the domestic wafer foundry sector, achieving breakthroughs in advanced processes and specialty processes through continuous R&D and capacity expansion [3] - Jinghe Integrated Circuit's core production base is located in Hefei, with a production capacity for 12-inch wafers [3] - The company has been increasing its R&D investment and accelerating the layout of advanced process nodes, particularly in power management chips and display driver chips, establishing a stable customer base and promoting domestic substitution [3] Group 3 - The listing in Hong Kong is expected to help the company broaden its financing channels, enhance capital strength, and accelerate its international strategy, improving its competitive position in the global semiconductor supply chain [3] - The domestic wafer foundry industry is experiencing rapid development opportunities due to the continuous growth in global semiconductor market demand [3] - The company plans to use the funds raised from the listing to further expand production line construction, optimize product structure, and accelerate R&D investment in high-end processes, thereby continuously enhancing its core competitiveness and supporting the self-controllable development of China's semiconductor industry chain [3]