【科技自立·产业自强】天承科技：以自主研发为本 努力成为高端专用功能性湿电子化学品领域行业领军品牌

Core Viewpoint - Tiancheng Technology is recognized for its advanced products and technologies in the fields of printed circuit boards, packaging substrates, semiconductors, and display panels, aiming to become a leading brand in high-end functional wet electronic chemicals [1][2] Group 1: Product and Technology Development - The company’s products are widely used in printed circuit boards, packaging substrates, semiconductors, and display panels [1] - In the fields of printed circuit boards and packaging substrates, the company competes closely with international rivals, receiving high praise for its products and technical services [1] - The company has achieved stability in product performance, particularly in metallization technology for polyimide, PET resin, and ABF materials, gaining recognition from mainstream packaging substrate manufacturers and top OEMs [1] - The company’s products in semiconductor packaging and advanced processes, including RDL, bumping, TSV, and Damascus plating series, have been validated by well-known packaging manufacturers, meeting international advanced standards [1] Group 2: Research and Development Initiatives - In response to the trends in high-performance computing and artificial intelligence, the company has rapidly invested in the research and development of TGV metallization technology for glass substrates, receiving broad recognition across the industry [1] - The company has established deep cooperative relationships with top OEMs to jointly promote the industrialization process [1] - In 2023, the company successfully developed RDL, bumping, TSV, and TGV plating additives for advanced semiconductor packaging and Damascus plating additives for wafer manufacturing, achieving downstream promotion verification [1] - In 2024, the company formed a semiconductor division and completed the construction of a project for specialized wet electronic chemicals for integrated circuits, aiding the localization process of plating additives in the semiconductor field [1] Group 3: Future Aspirations - The company will continue to focus on independent research and development, exploring the integration of cutting-edge processes to address critical technology challenges, aiming to become an industry leader in high-end specialized functional wet electronic chemicals [2]