芯碁微装实控人拟套现3.7亿 正拟发H股A股2募资共12.6亿

Group 1 - The core point of the news is that the controlling shareholder and actual controller of Chipbond Microelectronics, Cheng Zhuo, plans to reduce his shareholding by up to 2,634,814 shares, which is no more than 2.00% of the total shares, due to personal funding needs [1] - As of the announcement date, Cheng Zhuo directly holds 36,787,490 shares, accounting for 27.92% of the company's total share capital [1] - The planned reduction will be executed through a combination of centralized bidding and block trading within three months after the announcement, with specific limits on the number of shares that can be sold in any 90-day period [1] Group 2 - Chipbond Microelectronics was listed on the Sci-Tech Innovation Board on April 1, 2021, with an issuance of 30,202,400 shares at a price of 15.23 yuan per share, raising a total of 460 million yuan [2] - The net amount raised after deducting issuance costs was 416 million yuan, which was 57.08 million yuan less than the original plan [2] - The funds raised were allocated to various projects, including 208 million yuan for upgrading high-end PCB laser direct imaging equipment and 108 million yuan for research and development of flat panel display lithography equipment [2] Group 3 - On August 8, 2023, Chipbond Microelectronics disclosed that it issued 10,497,245 shares at a price of 75.99 yuan per share, raising a total of approximately 797.69 million yuan [3] - After deducting issuance costs, the net amount raised was approximately 789.36 million yuan [3] - The main underwriter for this issuance was Haitong Securities [3] Group 4 - The total fundraising from both the IPO and the private placement amounts to 1.258 billion yuan [4] - On September 16, 2025, Chipbond Microelectronics announced that it had submitted application materials for issuing overseas listed shares (H shares) to the China Securities Regulatory Commission [4] - The company applied for listing H shares on the Hong Kong Stock Exchange on August 31, 2025 [4]