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国信证券10月通信行业投资策略:AI高景气度延续 算力基础设施持续受益
Zhi Tong Cai Jing·2025-10-09 09:18

Core Viewpoint - The global AI sector continues to thrive, with significant capital expenditures planned by North American and Chinese cloud service providers (CSPs) for 2025, indicating strong growth potential in AI infrastructure and related technologies [1][3]. Group 1: North American CSPs - North American CSPs, including Amazon, Google, Meta, Microsoft, and Oracle, plan to spend over $370 billion on capital expenditures in the 2025 fiscal year, representing a 40% year-on-year increase [1]. - Oracle's latest quarterly report shows a remaining performance obligation (RPO) of $455 billion at the end of FY26Q1, an increase of $317 billion from the previous quarter, with expectations of $35 billion in capital expenditures for FY26 [1]. - Benefiting from AI development, Hon Hai Precision Industry (Foxconn), a major manufacturer for NVIDIA, reported September revenue of NT$837.1 billion, a significant increase of 38.01% month-on-month and 14.19% year-on-year, marking a historical high for the same period [1]. Group 2: Chinese CSPs - Chinese CSPs, including ByteDance, Alibaba, Tencent, and Baidu, are expected to invest over 450 billion yuan in AI computing power by 2025, with a rapid industrialization process for domestic super-node computing clusters [3]. - In September, Alibaba unveiled its next-generation Panjiu 128 super-node AI server at its Cloud Summit, while ZTE showcased a super-node server supporting 64 GPUs and advanced CPU and large-capacity switch chip plans [3]. - Huawei announced a super-large computing cluster capable of supporting 520,000 NPUs, potentially reaching nearly one million NPUs at its 2025 Fully Connected Conference [3]. Group 3: Technology and Infrastructure - The demand for optical modules is strong, with the industrialization of new technologies like CPO and OCS accelerating [4]. - Major chip manufacturers such as NVIDIA, AMD, and Broadcom are expanding their collaborations with CSPs, leading to increased demand for high-end chips [4]. - TSMC, a key supplier of advanced packaging technology (CoWoS), is enhancing its CoWoS capacity in response to the rising demand for optical modules [4]. Group 4: Investment Recommendations - The upcoming Q3 earnings season is expected to validate the high demand for computing power infrastructure, with recommendations to focus on optical devices, communication equipment, liquid cooling, and edge computing [5]. - Specific investment targets include China Mobile, Zhongji Xuchuang, ZTE, and Guanghetong, with a suggestion for long-term allocation in major telecom operators due to their stable operations and increasing dividend payouts [5].