天山电子：公司与天链芯、新存科技三方共同推进首款企业级SSD混合盘的研发、设计等阶段性工作正在推进中

Group 1 - The company is currently collaborating with Tianlian Chip and Xincun Technology to advance the research and design of its first enterprise-level SSD hybrid drive [2] - The development and design work is progressing in an orderly manner [2] - The company will strictly adhere to relevant laws and regulations to fulfill its information disclosure obligations in a timely manner [2]