衡封新材完成数千万元Pre-B轮融资，毅达资本领投

Core Insights - Hengfeng New Materials has completed several million yuan in Pre-B round financing, led by Yida Capital, with participation from Lingang Digital Fund and Shangyan Xingu Fund, while existing shareholder Yaotu Capital continues to invest [1][3] - The company, established in 2018, aims to become a global leader in electronic-grade specialty phenolic resin and specialty phenolic epoxy resin technology, supported by a team with over 20 years of experience in the industry [1][3] Company Overview - Hengfeng New Materials specializes in electronic-grade phenolic resin and specialty epoxy resin, which are widely used in semiconductor packaging, copper-clad laminates, photoresists, and electronic adhesives [3] - The company has modern production lines established in Anhui and Taizhou, with recent financing exceeding 100 million yuan, aimed at upgrading its product supply system and strategic layout in the electronic-grade specialty phenolic resin and specialty phenolic epoxy resin market [3] Investment Perspective - Yida Capital's partner highlighted the founding team’s extensive experience in multinational corporations, indicating a strong technical background and broad customer resources [3] - The products are considered critical materials in the semiconductor packaging sector, with high technical barriers for high-end products, aligning with the trend of domestic substitution [3] - There is an expectation for Hengfeng to achieve both quantitative breakthroughs and qualitative advancements during its expansion, alongside a focus on cash flow management and product quality during capacity ramp-up [3]