科创债发行持续扩容，科创债ETF博时(551000)小幅飘红

Core Insights - The issuance of technology innovation bonds (科创债) has significantly increased in 2023, with 47 banking institutions successfully issuing 52 bonds totaling 261.5 billion yuan [2] - The policy support from the People's Bank of China and the China Securities Regulatory Commission has facilitated a more efficient and recognized issuance process for technology innovation bonds, providing banks with stable, long-term, and low-cost funding sources [3] Group 1: Market Performance - The BoShi Technology Innovation Bond ETF (科创债ETF博时) has seen a slight increase of 0.05%, with the latest price at 99.3 yuan [2] - The ETF recorded a trading volume of 6.9147 million yuan with a turnover rate of 0.07% during the trading session [2] - Over the past week, the average daily trading volume of the ETF reached 3.778 billion yuan [2] Group 2: Issuance Details - The issuance of technology innovation bonds has been supported by a policy that allows flexible bond terms, encouraging long-term bonds that better match the funding needs of the technology sector [2] - Among the 52 bonds issued, over 30 were from local small and medium-sized banks, which accounted for more than 60% of the total issuance, making them the main contributors to the technology innovation bond market [2] Group 3: Fund Growth - The BoShi Technology Innovation Bond ETF has experienced a significant growth of 12.33 million yuan in scale over the past two weeks, ranking third among comparable funds [3] - In terms of shares, the ETF saw an increase of 7.318 million shares over the past three months, also ranking third among comparable funds [3] - The ETF closely tracks the Shanghai Stock Exchange AAA Technology Innovation Company Bond Index, reflecting the overall performance of technology innovation bonds listed on the exchange [3]