兴森科技：CSP封装基板订单饱满 新扩产能处于量产爬坡阶段

Core Viewpoint - The company is experiencing a recovery in demand for CSP packaging substrates due to the resurgence in the downstream storage chip and consumer sectors, leading to full order books and new capacity ramping up [1] Group 1 - The CSP packaging substrate orders are robust, indicating a positive market outlook [1] - The new production capacity is currently in the ramp-up phase, suggesting potential for increased output in the near future [1] - The FCBGA packaging substrate project is in the market expansion and order introduction phase, highlighting ongoing efforts to capture market share [1]