力合微：公司研发的三合一芯片主要解决了多颗独立通信芯片或模组带来的硬件成本高等问题

Core Viewpoint - The company has developed a three-in-one chip that addresses the issues of high hardware costs, large size, and complex structure associated with multiple independent communication chips or modules [1] Group 1 - The three-in-one chip integrates three communication functions into a single chip [1] - This innovation fundamentally overcomes the challenges posed by traditional communication chip designs [1] - The chip provides an optimized multi-mode communication solution for smart home applications and the Internet of Things (IoT) [1]