德福科技(301511.SZ)：自主研发的3um超薄载体铜箔、RTF1-3代铜箔、HVLP1-3代铜箔均已批量稳定供货

Core Viewpoint - Defu Technology (301511.SZ) has successfully achieved stable mass supply of its self-developed 3um ultra-thin carrier copper foil, RTF1-3 generation copper foil, and HVLP1-3 generation copper foil, marking a significant step in domestic substitution for these products [1] Group 1 - The company has developed and is now supplying 3um ultra-thin carrier copper foil [1] - The RTF1-3 generation copper foil has also reached stable mass production [1] - HVLP1-3 generation copper foil is now being supplied in bulk [1]