厦门有望再添一家A股上市公司！

Core Viewpoint - Xiamen Youxun Chip Co., Ltd. has successfully passed the IPO application for listing on the Shanghai Stock Exchange's Sci-Tech Innovation Board, highlighting its status as a leading player in the optical communication chip sector in China [1] Group 1: Company Overview - Founded over 20 years ago, Youxun specializes in the research, design, and sales of optical communication front-end transceiver chips, being one of the few companies in China to provide comprehensive optical communication chip solutions across all application scenarios [2] - The company has established a full-process testing capability from wafer testing to finished product testing and system-level verification, demonstrating its advanced chip design capabilities and autonomous high-reliability mass production testing technology [2] Group 2: Market Position and Achievements - In the market for products with speeds of 10Gbps and below, Youxun holds the largest market share in China and the second largest globally for the year 2024, reflecting its strong performance in niche segments [3] - Youxun has been recognized as a national "Manufacturing Single Champion Enterprise" by the Ministry of Industry and Information Technology, underscoring its commitment to independent innovation [3] Group 3: Research and Development - From 2022 to 2024, Youxun has invested over 216 million yuan in R&D, accounting for 20.34% of its revenue, with R&D personnel making up 57.04% of its workforce by the end of 2024 [5] - As of June 30, 2025, the company has obtained 114 authorized patents, including 83 invention patents and 32 integrated circuit layout design patents, establishing a solid technological barrier for its core products [5] Group 4: Fundraising and Future Projects - Youxun plans to raise approximately 809 million yuan through its IPO, which will be allocated to the development and industrialization of next-generation access network and high-speed data center chips, automotive chip R&D, and the development of optical communication chips and silicon photonic components at 800G and above [6]