Core Insights - Diamond semiconductor is emerging as a focal point in the semiconductor market, particularly after recent export control announcements by the Chinese government aimed at safeguarding national security and fulfilling international obligations [1][2] - The fourth generation of semiconductor materials, which includes diamond, is characterized by extreme bandgap widths, enabling superior performance in high voltage, high temperature, and high radiation environments [2][3] Industry Developments - The diamond semiconductor market is gaining traction as it offers significant advantages over traditional silicon and third-generation materials like silicon carbide (SiC) and gallium nitride (GaN) [3][4] - Diamond has a bandgap width of approximately 5.5 eV, making it the highest-performing material in the fourth generation, with exceptional thermal conductivity that is 13 times greater than silicon [2][3] Applications and Innovations - In the automotive sector, diamond semiconductors can enhance the performance and safety of electric vehicles, particularly as the industry shifts towards 800V high-voltage platforms [4] - In high-frequency communication, diamond's high carrier mobility positions it as an ideal medium for applications such as radar systems and satellite communications [4] - The unique quantum properties of diamond, particularly the NV center, make it a promising candidate for quantum computing applications, allowing operations at room temperature [4] Global Progress - Japan is at the forefront of diamond semiconductor technology, with significant advancements expected between 2025 and 2030, including the development of the world's first diamond semiconductor power device [6][7] - Companies like Orbray are working on mass production techniques for diamond wafers, which could alleviate production bottlenecks and set new industry standards [6][7] Domestic Developments - In China, universities and companies are accelerating the industrialization of diamond semiconductors, with notable advancements in the production of high-quality diamond substrates and films [8][10] - Companies such as Huawei are also making strides in diamond chip technology, focusing on hybrid bonding methods to improve thermal management in integrated circuits [9][10] Challenges Ahead - The diamond semiconductor industry faces challenges in material growth, with current substrate sizes being significantly smaller than those of silicon wafers, which limits integration and production efficiency [13][14] - Technical bottlenecks in fabrication methods and doping techniques for p-type and n-type semiconductors remain significant hurdles that need to be addressed for broader application [13][14]
金刚石半导体，产业化还有多远？
3 6 Ke·2025-10-20 11:34