Core Insights - The Foundry 2.0 market is expected to see a 19% year-over-year revenue growth in Q2 2025, driven by advancements in process technology and packaging [1] - TSMC's market share increased from 31% in the same period last year to 38% in Q2 2025, benefiting from the ramp-up of 3nm production and high utilization rates in 4/5nm due to AI GPU demand [1] - Advanced packaging is becoming a significant growth driver, with OSAT segment revenue growth accelerating from 5% to 11% year-over-year in Q2 2025, primarily contributed by ASE [1] - The importance of advanced packaging technology is rising, leading to increased dependency of chip design companies on packaging solutions [1] Group 1 - Foundry 2.0 market revenue is projected to grow 19% year-over-year in Q2 2025 [1] - TSMC's market share increased to 38% in Q2 2025, contributing over 70% to overall Foundry 2.0 revenue growth [1] - Advanced packaging is expected to drive OSAT growth, with a year-over-year increase from 5% to 11% in Q2 2025 [1] Group 2 - AI GPU and AI ASIC advanced packaging will continue to drive OSAT growth in 2025-2026 [1] - The reliance of chip design companies on packaging technology is expected to increase [1]
机构:Foundry 2.0年增19%,台积电市占达38%