Workflow
AI专题:2025年度国产AI芯片产业白皮书
Sou Hu Cai Jing·2025-10-22 02:48

Core Insights - The report titled "2025 National AI Chip Industry White Paper" focuses on the development of domestic AI chips, highlighting their significance, challenges, innovation directions, industry landscape, core applications, and research conclusions [1] Industry Significance and Challenges - AI chips are considered the cornerstone of computing power and a key factor in global technological competition. Domestic chips must overcome three main challenges: architectural dominance, ecological shortcomings, and large-scale implementation [1] - The report emphasizes the need for breakthroughs through traditional architecture optimization and emerging architecture innovations such as RISC-V and integrated storage-computing [1] Innovation Directions - Key innovation areas include mainstream architecture AI innovations (AI instruction sets and hardware optimizations for x86, Arm, RISC-V), sparse computing (hardware support for zero-value skipping to enhance energy efficiency), FP8 precision (mass production by companies like Moer Thread to improve computing throughput), and system-level optimizations (Chiplet, integrated storage-computing, photonic integration) [1] - Domestic companies like Moer Thread, Huawei, and Yuntian Lifi have made significant advancements in sparse computing [1] Industry Landscape - The industry has developed a multi-category layout including CPU, AI SoC, cloud/edge/vehicle AI chips, and GPU, with companies concentrated in Shanghai (15), Beijing (8), and Guangdong (6). Leading firms include Huawei HiSilicon (Ascend series), Kunlun Chip (Baidu's 7nm XPU architecture), and Moer Thread (MTT S5000 supporting FP8) [1] - Research indicates that general parallel architecture (GPU clusters) is a preferred direction for computing power platforms, with computing density and software ecology being core bottlenecks [1] Core Applications - The intelligent computing industry is projected to reach a scale of 725.3 EFLOPS in 2024 and 1460.3 EFLOPS by 2026, with domestic clusters like Huawei Ascend 160,000-card cluster and Kunlun Chip's Baijie cluster already operational [1] - The smart driving industry shows a significant trend towards integrated cockpit solutions, with mass production of chips like Xiaopeng Turing and Horizon Journey 6P [1] - In the robotics sector, companies like Yushu Technology and UBTECH are accelerating commercialization, focusing on niche scenarios for domestic chips [1] - Edge AI applications cover AloT and smart home sectors, aiming for a balance between energy efficiency and cost [1] Research Conclusions - Full-stack domestic solutions are favored, with intelligent cockpit chips and industrial collaborative robots identified as key breakthrough scenarios. Ecological development needs to consider both full-stack closed-loop and open-source collaboration [1]