Core Viewpoint - Shanghai Hojin Silicon Materials Co., Ltd. plans to issue technology innovation bonds to enhance its financing capabilities and support technological innovation efforts, with a total issuance amount not exceeding RMB 600 million [9][10][13]. Group 1: Bond Issuance Details - The proposed bond issuance aims to raise funds for technological innovation and to optimize the company's debt structure [9][13]. - The bond issuance will have a maximum term of 5 years, with specific terms to be determined based on market conditions [10]. - The company will seek authorization from the shareholders' meeting to proceed with the bond issuance and related decisions [11][14]. Group 2: Foreign Exchange Hedging - The company intends to conduct forward foreign exchange settlement and sales to hedge against exchange rate risks associated with its international trade activities [20][21]. - The maximum contract value for these forward transactions will not exceed RMB 150 million, with a maximum margin and premium of RMB 60 million [22][25]. - The company will only engage in hedging transactions and will not pursue speculative trading [21][26]. Group 3: Shareholders Meeting - The first extraordinary shareholders' meeting of 2025 is scheduled for November 12, 2025, to discuss the bond issuance and other matters [35][37]. - The meeting will allow for both on-site and online voting, ensuring participation from shareholders [36][39]. - The company has implemented a reminder service to facilitate attendance and voting for minority shareholders [41].
上海合晶硅材料股份有限公司2025年第三季度报告