兴森科技：公司具备制造大尺寸高层数超精细线路FCBGA封装基板的能力，可以满足车规级产品的要求

Core Viewpoint - The company has confirmed its capability to manufacture large-size, high-layer count ultra-fine line FCBGA packaging substrates that meet automotive-grade product requirements [1] Company Summary - The company, Xingsen Technology (002436.SZ), responded to an investor inquiry on October 27, indicating its ability to produce packaging substrates suitable for automotive applications [1]