莱普科技科创板IPO进入问询阶段

Core Viewpoint - Chengdu Leap Technology Co., Ltd. has entered the inquiry stage for its IPO on the Sci-Tech Innovation Board, aiming to raise approximately 850 million yuan for various projects and working capital [1] Company Overview - Leap Technology focuses on advanced precision laser technology and semiconductor innovation processes, primarily engaged in the R&D, production, and sales of high-end semiconductor equipment [1] IPO Details - The company’s IPO was accepted on September 29, 2025, and it plans to invest in several key projects, including the development and manufacturing center for wafer fabrication equipment, advanced packaging equipment, R&D center, and marketing network [1] - The total amount intended to be raised is around 850 million yuan, which will be allocated to projects based on urgency after deducting issuance-related expenses [1]