天风证券：2024年度第二期短期融资券兑付完成的公告

Core Points - Tianfeng Securities successfully issued its second short-term financing bond for 2024 on October 30, 2024, with a total issuance scale of RMB 1.26 billion and a coupon rate of 2.6% [1] - The bond has a maturity period of 359 days, with a repayment date set for October 24, 2025, when the company will repay a total of RMB 1,292,221,479.45, including both principal and interest [1] Summary by Category - Issuance Details - The short-term financing bond was issued with a scale of RMB 1.26 billion [1] - The coupon rate for the bond is set at 2.6% [1] - The bond has a maturity period of 359 days [1] - Repayment Information - The repayment date for the bond is October 24, 2025 [1] - The total amount to be repaid, including principal and interest, is RMB 1,292,221,479.45 [1]