LG化学，推出尖端半导体封装新材料

Core Insights - LG Chem has developed a cutting-edge semiconductor packaging core material, liquid PID (Photo Imageable Dielectric), to enter the AI and high-performance semiconductor market [2] - PID is essential for establishing microcircuits and forming transmission channels between semiconductor chips and substrates, enhancing circuit precision and semiconductor performance [2] - The demand for high-performance semiconductors is increasing, highlighting the importance of PID [2] Material Characteristics - The liquid PID features high resolution, stable curing at low temperatures, low shrinkage, and low absorption rates, improving process stability [2] - It is free from PFAS, NMP, and toluene, aligning with environmental regulations [2] Challenges and Solutions - The risk of cracking due to thermal expansion differences increases with larger integrated circuit (IC) substrates [2] - Traditional liquid PID struggles with uniformity on large substrates; LG Chem has developed a film-type PID to address this issue [4] Expansion Plans - LG Chem is expanding its production and R&D scale in the advanced semiconductor packaging sector, covering various key backend materials [2][4] - The product categories include Copper-Clad Laminate (CCL), Die Attach Film (DAF), Non-Conductive Film (NCF), and Build-Up Film (BUF) [4]