深耕PCB技术二十载，红板科技铸就独特行业竞争优势

Core Insights - The core viewpoint of the articles emphasizes the technological strength of Hongban Technology as a key factor in its competitive position within the PCB industry, highlighting its two decades of continuous innovation and technical accumulation [1][3]. Group 1: Technological Advantages - Hongban Technology has established itself as a leader in the production of high-layer HDI boards, capable of producing boards with up to 26 layers, showcasing advanced technologies such as fine line processing and precise layer alignment [1]. - The company has developed a series of core technologies that ensure the stable supply of high-quality HDI boards, including X-type hole processing and impedance uniformity control [1]. Group 2: Market Performance - In 2024, Hongban Technology supplied 154 million mobile HDI mainboards to the top ten global mobile brands, accounting for approximately 13% of their total shipments, indicating strong market recognition [2]. - The company is a major supplier of battery boards for seven of the top ten mobile brands, with a supply volume of 228 million flexible and rigid-flex battery boards, representing about 20% of the total shipments of these brands [2]. Group 3: Strategic Positioning - Hongban Technology has successfully entered the IC substrate market, traditionally dominated by companies from Taiwan, South Korea, and Japan, by overcoming technical barriers and achieving mass production capabilities [3]. - The company’s IC substrate products have been integrated into the supply chains of well-known enterprises like Zhaoshengwei, enhancing its competitive position in this sector [3]. - As of the first three quarters of 2024, mainland Chinese manufacturers held only 8.3% of the global IC substrate market, making Hongban Technology's achievements significant for the domestic industry's advancement and reducing reliance on foreign suppliers [3].