onsemi’s Treo Platform Selected by Teledyne for Advanced Infrared Imaging Design

Core Insights - onsemi's Treo platform has been selected by Teledyne Technologies to develop next-generation readout integrated circuit (ROIC) ASICs for infrared imaging systems, emphasizing its advanced capabilities in aerospace, defense, security, and scientific applications [1][4]. Group 1: Technology and Features - The Treo platform is built on a 65nm node and features a modular architecture with a rich set of IP building blocks, which accelerates development and reduces time-to-market [2]. - Key features of the Treo platform include higher gate density for improved performance in a smaller footprint, lower power dissipation for enhanced efficiency, and dense on-chip energy storage for better signal integrity [7]. - The platform supports a wide temperature range, ensuring consistent performance in extreme conditions, and includes die stitching for large-format sensor designs [7]. Group 2: Strategic Importance - The Treo platform is manufactured in onsemi's East Fishkill, NY facility, which holds Category 1A Trusted Supplier accreditation, addressing the U.S. government's need for domestic chip manufacturing in support of national security [6]. - The platform's capabilities are critical for developing high-performance imaging sensors that operate reliably in harsh environments, which is essential for Teledyne's space products [5]. Group 3: Market Position and Future Outlook - onsemi is positioned to drive innovations in various megatrends, including vehicle electrification, sustainable energy grids, and industrial automation, with a focus on delivering intelligent power and sensing technologies [8]. - The collaboration with Teledyne Technologies highlights onsemi's role in advancing next-generation infrared imaging systems, which are vital for mission-critical applications [1][5].