兴森科技：回应ABF&FC - BGA载板材料国产化及产能开工率情况

Core Viewpoint - The company is actively working on the localization of materials and equipment in response to the urgent need for domestic technology substitution in the industry [1] Group 1: Localization Efforts - The current localization rate of key materials for ABF and FC-BGA packaging substrates is being determined based on customer plans and supplier capabilities [1] - The company is collaborating with customers to validate domestic materials and equipment [1] Group 2: Production and Capacity - The FCBGA packaging substrate project is currently in the small batch production stage, with market expansion and customer certification progressing as planned [1] - The timeline for mass production largely depends on industry demand recovery, customer production progress, and supplier management strategies [1]