受300mm硅片销量拉动 沪硅产业前三季度营收同比增长6.56%

Core Viewpoint - The company reported a revenue increase but continued to face net losses due to pricing pressures and market demand fluctuations in the semiconductor industry [1][2]. Financial Performance - For the first three quarters of 2025, the company achieved a revenue of 2.641 billion yuan, a year-on-year increase of 6.56%, while the net profit attributable to shareholders was a loss of 631 million yuan [1]. - In the third quarter, the revenue was 944 million yuan, reflecting a year-on-year growth of 3.79%, with a net profit loss of 265 million yuan [1]. Sales and Market Dynamics - The sales volume of 300mm semiconductor wafers increased by over 30% year-on-year, but the revenue growth was limited to approximately 16% due to price pressures [1]. - Conversely, the sales volume of 200mm semiconductor wafers decreased by about 10%, and revenue from contract processing services significantly declined due to weak end-market demand [1]. R&D Investment - The company invested a total of 253 million yuan in R&D for the first three quarters, marking a year-on-year increase of 21.63%, with the third quarter alone seeing an investment of 97.6 million yuan, up 15.42% [2]. - R&D efforts are focused on breakthroughs in 300mm semiconductor wafers and 300mm SOI wafers, targeting high-growth applications in AI, power devices, and data centers [2]. Production Capacity - As of June 2025, the company's combined production capacity for 300mm semiconductor wafers in Shanghai and Taiyuan reached 750,000 pieces per month, maintaining a leading position in China [2]. - The company plans to expand the production capacity of its 300mm SOI pilot line to 160,000 pieces per year by the end of 2025, covering high-end applications such as RF, silicon photonics, and automotive-grade high-voltage devices [3]. Industry Outlook - According to SEMI, China's investment in 300mm equipment is expected to reach $94 billion between 2026 and 2028, with significant growth in equipment spending for chip manufacturing in 2025 and 2026 [3]. - The number of mass production factories for 300mm chips in China is projected to increase from 62 at the end of 2024 to over 70 by the end of 2026, driving further demand for 300mm semiconductor wafers [3].