沪硅产业2025年前三季度实现营收26.41亿元

Core Viewpoint - The semiconductor silicon wafer industry is experiencing a complex environment with overall recovery but persistent price pressures, prompting the company to enhance its leading position in the 300mm wafer sector through technological advancements and capacity expansion [1] Financial Performance - For the first three quarters of 2025, the company achieved revenue of 2.641 billion yuan, a year-on-year increase of 6.56%, with third-quarter revenue of 944 million yuan, up 3.79% year-on-year [1] - The company's net profit attributable to shareholders fell short of expectations due to price competition, structural market adjustments, declining sales of 200mm wafers, and increased financial costs from high R&D investments and expansion project borrowings [1] R&D Investment - The company maintained a high level of R&D investment, with total R&D expenses reaching 253 million yuan in the first three quarters of 2025, a year-on-year increase of 21.63%, and third-quarter R&D spending of 97.76 million yuan, up 15.42%, accounting for 10.34% of revenue [2] - R&D efforts are focused on breakthroughs in 300mm silicon wafers and SOI wafers, targeting high-growth applications such as AI, power devices, and data centers, addressing structural gaps in high-end products [2] Product Development - In the first half of 2025, the company developed over 50 new 300mm wafer products, with more than 820 product specifications certified, serving over 100 customers across various fields including logic chips and power devices, enhancing market penetration and technological breadth [3] Capacity Expansion - The company is advancing its capacity upgrade projects for 300mm silicon wafers, with a combined capacity of 750,000 wafers per month in Shanghai and Taiyuan, expected to exceed 1.2 million wafers per month upon full completion [4] - The company is also focusing on transforming its 200mm and below product lines, with subsidiaries achieving over 500,000 wafers per month in production capacity for polishing and epitaxial wafers [4] Strategic Initiatives - By the end of 2024, the company established a pilot line for 300mm SOI wafers with an annual capacity of 80,000 wafers, planning to expand this to 160,000 wafers by the end of 2025, targeting high-end applications in RF, silicon photonics, and automotive sectors [5] - The company's strategy of simultaneous R&D and capacity expansion is expected to enhance its influence in the domestic semiconductor silicon wafer industry, with potential benefits from industry recovery and high-end product volume [5]