Workflow
中国取得新芯片材料第一名,遥遥领先于美国同行,助力军工飞跃
Sou Hu Cai Jing·2025-11-02 16:44

Group 1 - The global competition in chip technology has evolved from a focus on processes to a comprehensive competition, with China reportedly leading in third-generation chip materials, significantly surpassing its Western counterparts [1] - Most existing chips are based on silicon technology, which is approaching its limits, leading major manufacturers like TSMC, Intel, and Samsung to abandon traditional upgrade paths in favor of equivalent processes [3] - The global industry is exploring new chip technologies and materials, such as photonic and quantum chips, as alternatives to silicon [3] Group 2 - China faces significant challenges in advancing silicon chip technology due to difficulties in obtaining EUV lithography machines, which involve a complex supply chain requiring collaboration from thousands of companies across multiple countries [5] - In the realm of advanced chip technology, China is considered to be in the first tier alongside the United States, particularly in photonic and quantum chip technologies, although the exact competitive advantage remains unclear until large-scale commercialization occurs [5] - Chinese companies have reportedly achieved a leading position in the global gallium nitride (GaN) materials market, which is recognized as a third-generation chip material, with widespread applications, especially in mobile phone chargers [5][7] Group 3 - Innoscience, a Chinese company, holds a 30% share of the global GaN materials market, followed by American companies Navitas, Power Integrations, and EPC with shares of 17%, 15.2%, and 13.5% respectively [7] - GaN materials are not only used in mobile phone chargers but also in emerging technology sectors such as electric vehicles and high-speed rail, contributing to rapid advancements in these fields [7] - The application of GaN materials extends to military technology, enhancing the detection range of advanced radar systems and being utilized in various defense applications [7][9] Group 4 - In addition to GaN, China has made significant progress in other advanced chip materials such as gallium arsenide (GaAs), indium phosphide (InP), and silicon carbide (SiC), supporting technological advancements across various sectors [9]