USC(SH:688403) Xin Lang Cai Jing·2025-11-03 07:39Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a significant investment by acquiring a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd., and forming a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, marking a year-on-year growth of 21.05%, and a net profit of 124 million yuan, with a growth of 23.21% [9]. Group 2: Market Position and Financials - The company has a significant international presence, with overseas revenue accounting for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. - The main business of the company is integrated circuit advanced packaging and testing services, with display driver chip packaging accounting for 90.25% of its revenue [3][8]. - As of September 30, 2025, the number of shareholders increased to 23,500, with an average of 36,445 shares held per shareholder, indicating growing investor interest [9].