天图投资(01973.HK)获准注册发行不超3亿元科技创新债券

Core Viewpoint - TianTu Investment (01973.HK) has received a notification from the China Interbank Market Dealers Association regarding the registration of its technology innovation bonds, allowing the company to issue bonds totaling up to RMB 300 million [1] Group 1 - The company can issue technology innovation bonds with a total principal amount not exceeding RMB 300 million [1] - The effective period for the bond issuance is up to two years from the date of the registration notification [1] - Guosen Securities Co., Ltd. will act as the lead underwriter for the bond issuance, which will occur in batches during the effective period [1]