USC(SH:688403) Xin Lang Cai Jing·2025-11-03 13:30Core Insights - Hefei Xinhui Microelectronics Co., Ltd. (referred to as "the company") has strategically entered the storage chip packaging and testing sector by investing in Hefei Xinfeng Technology Co., Ltd. and collaborating with East China Technology (Suzhou) Co., Ltd. This move is crucial for expanding its display driver packaging and testing business boundaries and enhancing its competitive edge in the domestic and international storage chip markets [1][4] Group 1: Strategic Positioning - The company leverages the robust semiconductor industry cluster in Hefei, which has allowed it to achieve significant scale in display driver packaging and testing, thus accumulating valuable operational experience [1][2] - By adopting a combination investment model, the company directly acquired a 27.5445% stake in the target entities with an investment of 90.4841 million yuan, while also holding indirect stakes through private equity funds, minimizing risks associated with single business expansion [1][3] Group 2: Operational Efficiency - The local semiconductor ecosystem, including wafer manufacturing and substrate supply, significantly reduces supply chain costs and response times for the storage packaging and testing business [2] - The company plans to enhance its storage packaging capacity by the end of 2027, utilizing its efficient production management and customer service processes from the display driver sector to expedite the transition to large-scale operations [2][4] Group 3: Market Opportunities - The global storage chip market is experiencing structural opportunities driven by AI infrastructure demands, with a notable increase in prices for storage chips over the past six months [3] - The company’s entry into the storage packaging and testing market reflects its strategic foresight and market insight, aiming to establish a dual-core business model of "display + storage" to fuel long-term growth [3][4] Group 4: Technological Advancements - Collaboration with East China Technology, which possesses 3D CUBE solutions, positions the company to make breakthroughs in advanced packaging for 3D DRAM, addressing domestic market gaps and aligning with AI-era storage needs [3] - The company’s non-controlling equity layout helps mitigate short-term profit pressures while leveraging past financial advantages and local investment platforms to promote capacity expansion [3][4]