小米、OPPO入股，芯德半导体成立5年冲击港股IPO

Core Viewpoint - Jiangsu Xinde Semiconductor Technology Co., Ltd. has submitted an IPO application to the Hong Kong Stock Exchange, aiming to leverage its advanced packaging technology in the semiconductor industry to support the development of AI and other innovations [2]. Company Overview - Xinde Semiconductor was established in September 2020 and specializes in semiconductor packaging and testing solutions, including custom packaging products and testing services [2]. - The company is recognized as one of the first in China to possess advanced packaging technology capabilities, which are crucial for innovation in the post-Moore's Law era [2]. Financial Performance - For the fiscal years ending June 30, 2022, 2023, 2024, and 2025, Xinde Semiconductor reported revenues of approximately RMB 269.4 million, RMB 509.1 million, RMB 827.4 million, and RMB 475.0 million, respectively [4]. - The company incurred losses of about RMB 360.3 million, RMB 358.9 million, RMB 376.6 million, and RMB 218.6 million for the same periods [4]. Funding and Shareholding - Over the past five years, Xinde Semiconductor has completed over RMB 2 billion in financing, attracting investments from notable institutions such as Xiaomi, OPPO, and Nanchuang Investment [5]. - Major shareholders include Zhang Guodong, Pan Mingdong, and Liu Yi, who collectively hold approximately 24.95% of the shares, making them the largest single shareholder [8]. - Xiaomi Changjiang holds 2.61% and OPPO's affiliated company Xunxing Investment holds 1.14% of the shares [9].