Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically investing in the storage chip and advanced packaging sectors to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Overview - Hefei Xinhui Microelectronics Co., Ltd. specializes in high-end integrated circuit packaging and testing services, with its main products being integrated circuit packaging tests [3]. - The company was established on December 18, 2015, and went public on August 18, 2022. Its primary business involves gold bumping, wafer testing, and various packaging processes, contributing to a comprehensive service capability for display driver chips [8]. Group 2: Financial Performance - For the period from January to September 2025, the company achieved a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, with a year-on-year increase of 23.21% [9]. - As of September 30, 2025, the company had a total of 23,500 shareholders, an increase of 15.93% from the previous period, with an average of 36,445 circulating shares per person, up by 27.82% [9]. Group 3: Strategic Investments - The company has acquired a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and has formed a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging businesses [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, to meet customer demands and enhance its technological capabilities [2]. Group 4: Market Position and Trends - The company benefits from a significant overseas revenue share of 54.15%, largely due to the depreciation of the Chinese yuan [4]. - The main customers for the company's OLED products include several notable firms, indicating a strong market presence in the OLED sector [2].
汇成股份跌1.38%,成交额4.62亿元,近3日主力净流入-2623.56万