Nvidia(US:NVDA) Jing Ji Ri Bao·2025-11-04 23:48Core Insights - Aletheia Capital's report highlights a significant underestimation of the demand for advanced packaging, particularly CoWoS, driven by emerging AI applications [1] - The report predicts a substantial capacity shortfall for TSMC's CoWoS technology, with a projected gap of 400,000 units in 2026 and 700,000 units in 2027, indicating a severe supply-demand imbalance [1] Group 1: Demand Drivers - The growth in GPU shipments and the rapid expansion of photomask sizes are identified as the two main drivers for CoWoS demand [1] - New devices such as server CPUs, high-end PCs, and gaming console chips are expected to adopt CoWoS technology starting in the second half of this year, with a significant acceleration anticipated by 2026 [1] Group 2: Beneficiaries - Aletheia names six Taiwanese companies—TSMC, ASE Technology Holding, Kyec, ChipMOS, Wistron NeWeb, and Hongjing Precision—as beneficiaries of the positive industry trend, recommending a "buy" for these stocks [1] - TSMC's CoWoS-dependent chips include products from Nvidia, AMD, Microsoft, and Broadcom, indicating a broad reliance on TSMC's advanced packaging capabilities [2] Group 3: Capacity Expansion Challenges - Despite TSMC's plans to quadruple CoWoS capacity between 2024 and 2027, this expansion is expected to fall short of the rapidly growing demand, prompting customers to seek assistance from packaging manufacturers [2] - Companies like ASE and Amkor are expected to play crucial roles in packaging for new products, with significant increases in CoWoS demand projected between 2025 and 2027 [2] Group 4: Testing and Outsourcing - Kyec is set to benefit from strong growth in testing services for Broadcom's AI ASICs starting in 2026, as well as from TSMC's outsourcing of wafer probing tests [2] - Wistron NeWeb is also expected to gain from TSMC's outsourcing strategy, as packaging manufacturers increasingly adopt Wistron NeWeb's solutions [2]