Loctek(SZ:300729) 智通财经网·2025-11-05 08:52Core Viewpoint - The successful issuance of the first phase of technology innovation bonds by Lege Co., Ltd. marks a significant milestone in the domestic smart home and public overseas warehouse sector, showcasing the company's strong market position and innovative financing strategies [1][2] Group 1: Bond Issuance Details - Lege Co., Ltd. issued a technology innovation bond with a registered amount of 800 million yuan and an issuance scale of 250 million yuan, with a maturity of 546 days and a coupon rate of 2.59% [1] - The bond is rated AAA and is the first technology innovation bond issued by a furniture manufacturing enterprise in the entire market, as well as the first for a privately listed company on the Growth Enterprise Market in Zhejiang Province [1] Group 2: Use of Proceeds - The funds raised from the bond issuance will be used entirely to repay the company's maturing debts, thereby reducing the overall cost of capital and supporting the company's high-quality development [1] Group 3: Market Recognition and Future Plans - The successful bond issuance is seen as a recognition of the company's stable operations and sustainable development strategy, following previous financing activities including convertible bonds and stock issuances [2] - The company plans to continue expanding its financing channels to enhance its competitiveness and influence in the capital market, laying a solid foundation for long-term development [2]