帝尔激光：超快激光钻孔设备样机正在试制中

Core Viewpoint - The company has successfully completed the shipment of its TGV laser micro-hole equipment for panel-level glass substrates, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology [1] Group 1: Company Developments - The company's PCB business is primarily focused on the development of ultrafast laser drilling technology [1] - The company has engaged with 2 to 3 clients for its ultrafast laser drilling technology [1] - Prototypes of the ultrafast laser drilling equipment are currently in the trial production stage [1]